Substrate transfer mechanism to reduce back-side substrate contact

ABSTRACT

A substrate processing system is disclosed which includes a processing chamber comprising a susceptor having a first surface and a second surface opposite to the first surface, a groove formed in the first surface adjacent to a perimeter thereof, and a substrate support structure including a plurality of carrier lift pins, each of the plurality of carrier lift pins movably disposed in an opening formed from the second surface to the first surface, wherein the opening is recessed from the groove.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.16/899,043, filed Jun. 11, 2020, which is a divisional of U.S. patentapplication Ser. No. 15/894,735, filed Feb. 12, 2018, both of which arehereby incorporated by reference in their entireties.

BACKGROUND Field

The present disclosure generally relates to a method and apparatus fortransferring substrates in a processing tool. More specifically, thepresent disclosure relates to a method and apparatus for transferringsubstrates in a chamber or multiple chambers of the processing tool.

Description of the Related Art

Ultra-large-scale integrated (ULSI) circuits may include more than onemillion electronic devices (e.g., transistors) that are formed on asemiconductor substrate, such as a silicon (Si) substrate, and cooperateto perform various functions within the device.

Many conventional thermal processes are commonly used in the fabricationof transistors and other electronic devices. These processes aretypically performed in a tool having multiple chambers, such as acluster tool. Particle generation and/or damage to a substrate is ofutmost concern during these processes in order to achieve a desiredyield. However, one source of particles and/or damage occurs duringsubstrate transfer, i.e., when the substrate is moved within aparticular process chamber on the tool, or when a substrate is movedfrom one chamber of the tool to another chamber of the tool.

It has been determined that conventional substrate lift pins, whichcontact a backside, i.e., a side opposing a deposit receiving side, of asubstrate during transfer, are one cause of particles and/or substratedamage. For example, the contact of the substrate with lift pins mayscratch the substrate and/or cause particles from the contact. Theparticles from contact may contaminate the chamber, the substrate, orsubsequent substrates, all of which reduces yield.

Therefore, there is a need for an improved method and apparatus fortransferring a substrate in a tool.

SUMMARY

The present disclosure generally relates to a method and apparatus fortransferring substrates in a processing tool. More specifically, thepresent disclosure relates to a method and apparatus for transferringsubstrates in a chamber or multiple chambers of the processing tool.

In one embodiment, A substrate processing system is disclosed whichincludes a substrate input/output chamber coupled to a transfer chamber,and one or more processing chambers coupled to the transfer chamber,wherein the substrate input/output chamber includes a plurality ofstacked carrier holders, and one of the carrier holders includes asubstrate carrier to support a substrate thereon.

In another embodiment, a load lock chamber is disclosed which includes aplaten having a heat transfer element embedded therein, a plurality ofcarrier holders positioned about the platen, and a plurality of supportmembers extending from each of the stacked carrier holders, and acarrier positioned on the support members of one of the plurality ofstacked carrier holders.

In another embodiment, a processing chamber is disclosed that includes asusceptor having a groove formed therein adjacent to a perimeterthereof, and a substrate support structure including a plurality ofcarrier lift pins, wherein each of the carrier lift pins is received inan opening adjacent to the groove.

BRIEF DESCRIPTION OF THE DRAWINGS

So that the manner in which the above recited features of the presentdisclosure can be understood in detail, a more particular description ofthe disclosure, briefly summarized above, may be had by reference toembodiments, some of which are illustrated in the appended drawings. Itis to be noted, however, that the appended drawings illustrate onlytypical embodiments of this disclosure and are therefore not to beconsidered limiting of its scope, for the disclosure may admit to otherequally effective embodiments.

FIG. 1 depicts a schematic diagram of an exemplary processing apparatussuitable for practice the present disclosure.

FIG. 2 is a cross-sectional view of the load lock chamber according toone embodiment of the disclosure.

FIG. 3A depicts one embodiment of the carrier holders in the load lockchamber.

FIG. 3B is an isometric view of another embodiment of the first carrierholder and the second carrier holder.

FIGS. 4A-4G are various views showing a substrate transfer sequencebetween the factory interface, the load lock chamber, and the transferchamber of FIG. 1 .

FIGS. 5A-5C are various view of the cooling platen and other componentsof associated with the cooling platen of the load lock chamber.

FIG. 6 is a schematic cross-sectional view of a portion of the coolingplaten and the carrier.

FIGS. 7A-7D are various views showing details of the load lock chamber.

FIG. 8 is an enlarged sectional view of the motor coupled to the supportplate via a flexible joint member.

FIGS. 9A and 9B are isometric views of the load-lock chamber showingdetails of the vacuum system.

FIG. 10 is a schematic sectional view of a process chamber according toone embodiment.

FIG. 11 is an isometric view of the susceptor of FIG. 10 .

FIG. 12 is an enlarged sectional view of a portion of the susceptor andthe carrier of FIG. 10 .

To facilitate understanding, identical reference numerals have beenused, where possible, to designate identical elements that are common tothe figures. It is contemplated that elements and features of oneembodiment may be beneficially incorporated in other embodiments withoutfurther recitation.

DETAILED DESCRIPTION

The present disclosure provides a method and apparatus transferringsubstrates in a processing tool. In particular, transferring a substrateusing a substrate transferring mechanism that minimizes contact withmajor surfaces of the substrate.

FIG. 1 is a schematic, top plan view of an exemplary processing system100 that includes one embodiment of a substrate transfer mechanismsuitable for practicing the present disclosure. The processing system100 includes a substrate input/output chamber 122 a vacuum-tightprocessing platform 104, a factory interface 102, and a systemcontroller 144. The substrate input/output chamber 122 may be a loadlock chamber. In one embodiment, the processing system 100 may be aCENTURA® integrated processing system, commercially available fromApplied Materials, Inc., located in Santa Clara, Calif. It iscontemplated that other processing systems (including those from othermanufacturers) may be adapted to benefit from the disclosure.

The platform 104 includes a plurality of processing chambers 110, 112,132, 128, 120 and at least one substrate input/output chamber 122 thatare coupled to a vacuum substrate transfer chamber 136. Two substrateinput/output chambers 122 are shown in FIG. 1 . The factory interface102 is coupled to the transfer chamber 136 by the substrate input/outputchambers 122.

In one embodiment, the factory interface 102 comprises at least onedocking station 108 and at least one factory interface robot 114 tofacilitate transfer of substrates. The docking station 108 is configuredto accept one or more front opening unified pod (FOUP). Two FOUPS 106A,10666 are shown in the embodiment of FIG. 1 . The factory interfacerobot 114 having a blade 116 disposed on one end of the robot 114 isconfigured to transfer the substrate from the FOUPS 106A, 10666 to theprocessing platform 104 for processing through the substrateinput/output chambers 122.

Each of the substrate input/output chambers 122 has a first port coupledto the factory interface 102 and a second port coupled to the transferchamber 136. The substrate input/output chambers 122 are coupled to apressure control system (not shown) which pumps down and vents thesubstrate input/output chambers 122 to facilitate passing the substratebetween the vacuum environment of the transfer chamber 136 and thesubstantially ambient (e.g., atmospheric) environment of the factoryinterface 102.

The transfer chamber 136 has a vacuum robot 130 disposed therein. Thevacuum robot 130 has a blade 134 capable of transferring substrates 124between the substrate input/output chambers 122 and the processingchambers 110, 112, 132, 128, 120.

The system controller 144 is coupled to the processing system 100. Thesystem controller 144 controls the operation of the system 100 using adirect control of the process chambers 110, 112, 132, 128, 120 of thesystem 100 or alternatively, by controlling the computers (orcontrollers) associated with the process chambers 110, 112, 132, 128,120 and the system 100. In operation, the system controller 144 enablesdata collection and feedback from the respective chambers and systemcontroller 144 to optimize performance of the system 100.

The system controller 144 generally includes a central processing unit(CPU) 138, a memory 140, and support circuit 142. The CPU 138 may be oneof any form of a general purpose computer processor that can be used inan industrial setting. The support circuits 142 are conventionallycoupled to the CPU 138 and may comprise cache, clock circuits,input/output subsystems, power supplies, and the like. The softwareroutines, when executed by the CPU 138, transform the CPU 138 into aspecific purpose computer (controller) 144. The software routines mayalso be stored and/or executed by a second controller (not shown) thatis located remotely from the system 100.

FIG. 2 is a cross-sectional view of the substrate input/output chamber122 according to one embodiment of the disclosure. The substrateinput/output chamber 122 generally comprises a chamber body 202, a firstcarrier holder 204B, a second carrier holder 204A, a temperature controlpedestal 240 and an optional heater module 270. Each of the firstcarrier holder 204B and the second carrier holder 204A include asubstrate 124 supported by a carrier 206. The chamber body 202 may befabricated from a singular body of material such as aluminum. Thechamber body 202 includes a first side wall 208, a second side wall 210,lateral walls 242 (only one is shown in FIG. 2 ), a top 214 and a bottom216 that define a chamber volume 218. Windows (not shown) may beprovided in the top 214 of the chamber body and are typically comprisedof quartz. When a heater module 270 is included, the top 214 of thechamber body 202 is at least partially covered by the heater module 270.

The pressure of the chamber volume 218 may be controlled so that thesubstrate input/output chamber 122 may be evacuated to substantiallymatch the environment of the transfer chamber 136 and be vented tosubstantially match the environment of the factory interface 102. Thechamber body 202 includes one or more vent passages 230 and a pumppassage 232. The flow within the substrate input/output chamber 122during venting and evacuation is substantially laminar due to theposition of the vent passage 230 and pump passage 232 and is configuredto minimize particulate contamination.

The pump passage 232 is coupled to the vacuum pump 236. The vacuum pump236 has low vibration to minimize the disturbance of the substrate 124positioned on the holders 204B, 204A within the substrate input/outputchamber 122 while promoting pump-down efficiency and time by minimizingthe fluid path between the substrate input/output chamber 122 and pump236 to generally less than three feet.

A first loading port 238 is disposed in the first side wall 208 of thechamber body 202 to allow the substrate 124 to be transferred betweenthe substrate input/output chamber 122 and the factory interface 102. Afirst slit valve 244 selectively seals the first loading port 238 toisolate the substrate input/output chamber 122 from the factoryinterface 102. A second loading port 239 is disposed in the second sidewall 210 of the chamber body 202 to allow the substrate 124 to betransferred between the substrate input/output chamber 122 and thetransfer chamber 136. A second slit valve 246 which is substantiallysimilar to the first slit valve 244 selectively seals the second loadingport 239 to isolate the substrate input/output chamber 122 from thevacuum environment of the transfer chamber 136.

The first carrier holder 204B is concentrically coupled to (i.e.,stacked on top of) the second carrier holder 204A that is disposed abovethe chamber bottom 216. The carrier holders 204B, 204A are generallymounted to a support 220 that is coupled to a shaft 282 that extendsthrough the bottom 216 of the chamber body 202. Typically, each carrierholder 204B, 204A is configured to retain one substrate positioned on arespective carrier 206. The shaft 282 is coupled to a lift mechanism 296disposed exterior to the substrate input/output chamber 122 thatcontrols the elevation of the carrier holders 204B and 204A within thechamber body 202. A bellows 284 is coupled between the support 220 andthe bottom 216 of the chamber body 202 and disposed around the shaft 282to provide a flexible seal between the second carrier holder 204A andthe bottom 216, thus preventing leakage from or into the chamber body202 and facilitating raising and lowing of the carrier holders 204B,204A without compromising the pressure within the substrate input/outputchamber 122.

The first carrier holder 204B is utilized to hold an unprocessedsubstrate from the factory interface 102 on a first carrier 206 whilethe second carrier holder 204A is utilized to hold a processed substrate(e.g., an etched substrate) on a second carrier 206 returning from thetransfer chamber 136.

FIG. 3A depicts one embodiment of the carrier holders 204B, 204A in thesubstrate input/output chamber 122. The carriers 206 are not shown inFIG. 3A for clarity. The second carrier holder 204A is generally heldabove the bottom 216 of the chamber body 202 by the support 220. A firststandoff 308 is disposed between each member 304, 306 to maintain thesecond carrier holder 204A in a spaced-apart relation to the support220. A second standoff 310 is disposed between the first and secondcarrier holders 204B, 204A to maintain a spaced-apart relationtherebetween. The standoffs 308, 310 allow blades 134, 116 of thetransfer and factory interface robots 130, 114 to pass therebetween whenretrieving and depositing substrates on the carrier holders 204B, 204A.Each holder 204B, 204A may have alternatively include a “L-shaped”configuration that incorporates a portion that maintains a spaced-apartrelation between holder 204B, 204A and adjacent components of thesubstrate input/output chamber 122.

Each carrier holder 204B, 204A includes a first member 304 and a secondmember 306. Each member 304, 306 includes a curved inner portion 312that has a lip 314 extending radially inwards therefrom. The curvedinner portion 312 is configured to allow the substrate 124 to rest onthe lip 314. The curved inner portion 312 captures the substrate 124therebetween, thus preventing the substrate 124 from falling off the lip314. The first member 304 faces the second member 306, with the curvedinner portions 312 of each pointing toward the other. The first member304 and the second member 306 are on opposite sides of a temperaturecontrol pedestal 240 that is centrally disposed within the chamber 122and projects from the bottom 216 thereof.

FIG. 3B is an isometric view of another embodiment of the first carrierholder 204B and the second carrier holder 204A. Each of the firstcarrier holder 204B and the second carrier holder 204A are shownsupporting a carrier 206. Support members 320 are shown between thecarrier 206 and the standoffs 308, 310. The carriers 206 may betransferred into the substrate input/output chamber 122 manually toinitialize the system. For example, the carriers 206 may be placed ontothe standoffs 308, 310 by opening the top 214 (shown in FIG. 2 ) orthrough one of the first loading port 238 or the second loading port239. The positioning process will be described in detail below.

Each of the support members 320 may be fabricated from a quartzmaterial. Each of the support members 320 interfaces with the standoffs308, 310 via an interference fit or other suitable coupling method. Thestandoffs 308, 310 may be made of a metallic material, such as stainlesssteel. The standoffs 308, 310 may be separated by a pitch or distance322 of about 1 inch. Each of the carriers 206 may be fabricated from aceramic material, such as silicon carbide. A distance 324 between anupper surface of the temperature control pedestal 240 and a lowersurface of the carrier 206 in the standoff 308 may be about 0.75 inches.

Referring back to FIG. 2 , the temperature control pedestal 240 iscoupled to the bottom 216 of the chamber body 202 by a support 278centrally located in the chamber 202. The support 278 may be hollow orcan include passages therethrough to allow fluids, electrical signals,sensor and the like to be coupled to the pedestal 240. The shaft 282 andlift mechanism 296 are positioned peripheral to the support 278.

The temperature control pedestal 240 has a temperature control surface292 for thermal control of substrates in proximity to the temperaturecontrol surface 292. The temperature control pedestal 240 includes aheat transfer element 286, which may be a circulated water jacket, athermoelectric device, such as a Peltier device, or other structure thatmay be utilized to control the temperature of the temperature controlsurface 292. For example, the heat transfer element 286 may include oneor more tubes disposed in the cooling platen 280 and fluidly coupled toa cooling fluid source (not shown) to circulate cooling fluid throughthe cooling platen 280.

The support 220 having the carrier holders 204B, 204A coupled theretomay be lowered to a first position where an upper surface 292 of thecooling platen 280 is in close proximity or in contact with thesubstrate supported by the second carrier holder 204A. In the firstposition, the cooling platen 280 may be used to regulate the temperatureof the substrate disposed on (or proximate to) the cooling platen 280.For example, a substrate returning from processing may be cooled in thesubstrate input/output chamber 122 during evacuation thereof bysupporting the substrate during on the upper surface 292 of the coolingplaten 280. Thermal energy is transferred from the substrate through thecooling platen 280 to the heat transfer element 286, to cool thesubstrate. After cooling the substrate, the carrier holders 204B, 204Amay be raised towards the top 214 of the chamber body 202 to allow therobots 130, 114 to access to the substrate seated in the secondsubstrate support 204A. Optionally, the holders 204B, 204A may belowered to a position where the upper surface 292 is in contact or closeproximity to the substrate supported by the first carrier holder 204B.In this position, the cooling platen 280 may be used to thermallyregulate and heat the substrate.

FIGS. 4A-4G are various views showing a substrate transfer sequencebetween the factory interface 102, the substrate input/output chamber122, and the transfer chamber 136 of FIG. 1 . FIG. 4A is a schematicside view of the substrate input/output chamber 122 showing a firstrobot blade 400 extending through the first loading port 238 of thesubstrate input/output chamber 122. The first robot blade 400 is shownsupporting an unprocessed substrate 405 from the factory interface 102of FIG. 1 . The first robot blade 400 may be one of the blades 116 ofthe factory interface robot 114 shown in FIG. 1 .

In addition to first loading port 238, the substrate input/outputchamber 122 includes the cooling platen 280, the second carrier holder204A, the first carrier holder 204B and carriers 206 disposed on theholders 204B, 204A via the support members 320. In addition, lift pins410, one of which is shown in cross-section, extend through the coolingplaten 280. Each of the lift pins 410 is coupled to an actuator 411 thatmoves the lift pin 410 in the Z direction. A bellows assembly 416 isprovided between the cooling platen 280 and the actuator 411. Aplurality of bushings 417 is also provided in the cooling platen 280 tofacilitate vertical movement of the lift pins 410 therein.

Each of the lift pins 410 is configured to contact a lower surface ofthe substrate 405 on an edge thereof. Each of the lift pins 410 includesa tip 412 disposed on an end of a shaft 413. The tip 412 is made of amaterial that is softer than the material of the shaft 413. For example,the shaft 413 may be fabricated from a metallic material, such asstainless steel, while the tip 412 may be fabricated from a polymermaterial. The softer material for the tips 412 prevents or minimizesscratching of the backside of the substrate 405. Example materials forthe tip 412 are fluoropolymers including polytetrafluoroethylene (PTFE),fluorinated ethylene propylene (FEP), perfluoroalkoxy (PFA), or othersuitable plastic materials. The tips 412 may be designed to couple to arespective shaft 413 via an interference fit. In the embodiment shown inFIG. 4A, the tips 412 include a protruded portion 414 that snugly fitsinto a depression 415 formed in the shaft 413.

The first robot blade 400 extends into the substrate input/outputchamber 122 through the first loading port 238 in the X direction. Thefirst robot blade 400 is programmed to position the substrate 405concentric with the carrier 206 disposed on the second carrier holder204A.

FIGS. 4B and 4C are schematic cross-sectional views of the substrateinput/output chamber 122 when the first robot blade 400 is positioned asshown in FIG. 4A. In addition to the first robot blade 400, the carriers206, and the substrate 405, the heat transfer element 286 is moreclearly shown within the cooling platen 280. The heat transfer element286 may be sealed into the cooling platen 280 using a cover plate 428.The cover plate 428 may be circular and fabricated from an aluminummaterial.

Referring again to FIG. 4A, the minimum clearance between the firstrobot blade 400 and any other component in the substrate input/outputchamber 122 is about 0.12 inches during this transfer process. Forexample, a distance 440 between a lower surface of the support members320 and an upper surface of the substrate 405 is about 0.12 inches; adistance 442 between an upper surface of the substrate 405 and a surfaceof the first loading port 238 is about 0.16 inches; a distance 444between a lower surface of the substrate 405 and an upper surface of thetip 412 is about 0.2 inches; and a distance 446 between the uppersurface of the tip 412 and an upper surface of the cooling platen 280 isabout 0.60 inches, or greater.

FIG. 4D is a schematic side view depicting another portion of thetransfer process discussed in the description of FIGS. 4A-4C. FIG. 4Dshows the substrate 405 transferred from the first robot blade 400 tothe lift pins 410. The transfer of the substrate 405 to the lift pins410 may be accomplished by vertical movement (Z direction) of the firstrobot blade 400. In this position, a distance 448 between the uppersurface of the first robot blade 400 and a lower surface of thesubstrate 405 may be about 0.2 inches. A distance 450 between the lowersurface of the first robot blade 400 and an upper surface of the carrier206 may be about 0.13 inches in this position. In this position, thefirst robot blade 400 may be retracted from the substrate input/outputchamber 122.

FIG. 4E is a schematic side view depicting another portion of thetransfer process discussed in the description of FIGS. 4A-4D. FIG. 4Eshows the substrate 405 transferred from the lift pins 410 to thecarrier 206 disposed on the second carrier holder 204A. In this view,the support 220 (shown in FIG. 2 ), which moves the holders 204B, 204Ain the Z direction, will be at its uppermost position. The uppermostposition of the support 220 raises both of the holders 204B, 204A towardthe top 214. Further, the lift pins 410 are retracted (lowered in the Zdirection) which allows a second robot blade 452, from the transferchamber 136, to enter the second loading port 239 as shown in FIG. 2 .The second robot blade 452 may be the blade 134 of the vacuum robot 130shown in FIG. 1 .

The second robot blade 452 is utilized to transfer the substrate 405, aswell as the carrier 206, to one or more of the processing chambers 110,112, 132, 128, 120 shown in FIG. 1 via the transfer chamber 136. In theposition shown in FIG. 4E, a distance 454 between a lower surface of thetop 214 and the carrier 206 disposed on the first carrier holder 204B isabout 0.25 inches, and a distance 456 between the upper surface of thesecond robot blade 452 and the lower surface of the carrier 206 may beabout 0.19 inches. To transfer the substrate 405 to the second robotblade 452, the support 220 (FIG. 2 ) is lowered in the Z direction bygreater than the distance 456. Thereafter, the second robot blade 452,having the carrier 206 and the substrate 405 thereon, may be retractedout of the second loading port 239 in the X direction.

FIG. 4F is a schematic side view depicting another portion of thetransfer process discussed in the description of FIGS. 4A-4E. FIG. 4Fshows a processed substrate 458 from the transfer chamber 136 (shown inFIG. 1 ) supported by the carrier 206, which is supported by the secondrobot blade 452. In this transfer process, the support 220 is at thelowermost position such that a space between the top 214 and the firstcarrier holder 204B is provided. In addition, the lift pins 410 areretracted. The substrate 458 is shown in FIG. 4F with the carrier 206concentrically aligned with the first carrier holder 204B.

FIG. 4G is a schematic side view depicting another portion of thetransfer process discussed in the description of FIGS. 4A-4F. In betweenthe positions shown in FIGS. 4F and 4G, the lift pins 410 are actuatedvertically (in the Z direction) from the position shown in FIG. 4F tothe position shown in FIG. 4G, which shows the substrate 458 supportedby the lift pins 410. Further, the carrier 206 is supported by the firstcarrier holder 204B. Once the substrate 458 is supported by the liftpins 410, as shown in FIG. 4G, the first robot blade 400 is actuatedlaterally (in the X direction) and/or vertically (in the Z direction) toremove the substrate 458 from the lift pins 410. Once the substrate 458is supported by the first robot blade 400, the first robot blade 400,with the substrate 458 thereon, may be moved through the first loadingport 238, and the substrate 458 may be placed in the factory interface102.

FIGS. 5A-5C are various view of the cooling platen 280 and othercomponents of associated with the cooling platen 280 of the substrateinput/output chamber 122. FIG. 5A is an isometric view of the coolingplaten 280, and the first carrier holder 204B and the second carrierholder 204A coupled to the support 220. FIG. 5B is an isometric partialsectional view of the cooling platen 280, one of the carriers 206, andthe support 220.

In FIG. 5A, a plurality of locating pins 500 are shown coupled to thecooling platen 280 in a peripheral region thereof. Each of the locatingpins 500 is temporarily positioned within an opening 505 formed aroundthe periphery of the cooling platen 280 (shown in FIG. 5B), and areutilized to center or position the carriers 206 onto the first carrierholder 204B and the second carrier holder 204A. The locating pins 500define an outer edge location of a carrier 206 when positioned on one ofthe first or second carrier holders 204A or 204B. For example, thecarriers 206 may be manually transferred into the substrate input/outputchamber 122, and the locating pins 500 are utilized to position thecarriers 206 with respect to the cooling platen 280. When the carriers206 are positioned on the first or second carrier holders 204A, 204B,the locating pins 500 closely confine the outer edge of each carrier 206to position the carriers 206 for processing. Once the carriers 206 arepositioned, the locating pins 500 may be removed. Each of the locatingpins 500 may be fabricated from a quartz material.

FIG. 5A also shows a plurality of alignment pads 510 coupled to thecooling platen 280. While only two pads 510 are shown in FIG. 5A,another pad is hidden by the first carrier holder 204B and the secondcarrier holder 204A.

Cross-sections of the pads 510 are shown in FIGS. 5B and 5C. Each of thepads 510 may be utilized to prevent contact between the carrier 206 andthe cooling platen 280. Further, as the carrier 206 is supported by thepads 510 during cooling, contact between a substrate (not shown) and theplaten 280 is prevented. For example, as the substrate would rest on asubstrate receiving surface 515 of the carrier 206, the pads 510 providea gap 520 between the upper surface of the cooling platen 280 and thesubstrate receiving surface 515 of the carrier 206. The substratereceiving surface 515 of the carrier 206 would coincide with a lowersurface of a substrate mounted thereon, and the gap 520 would extendfrom the lower surface of the substrate to the upper surface of thecooling platen 280. Similar to the locating pins 500, the pads 510 aremade from a quartz material.

FIG. 5C is an enlarged sectional view of the cooling platen 280, one pad510 of the plurality of pads 510, and the carrier 206. Each of the pads510 are generally “T”-shaped in cross-section and each pad 510 includesa planar shoulder portion 530 surrounding a protrusion 535 that extendsfrom the shoulder portion 530. An angled surface 540 is provided betweenthe shoulder portion 530 and the protrusion 535. Here the protrusion 535is frustoconical. The angled surface 540 may be utilized to center thecarrier 206 relative to the cooling platen 280. Each of the pads 510also include a pin portion 545 that is inserted into an opening 550formed in the cooling platen 280. The shoulder portion 530 fits into arecessed flange 555 of the cooling platen 280. A height 560 of theshoulder portion 530 is slightly greater than a depth of the recessedflange 555 in order to provide the gap 520.

FIG. 6 is a schematic cross-sectional view of a portion of the coolingplaten 280 and the carrier 206. The carrier 206 has a substrate 600supported on the substrate receiving surface 515 thereof. The carrier206 includes a circular body 605 having a concave groove 610 formed inthe body 605 opposite to the substrate receiving surface 515. Here, thecircular body 605 is annular. Peripheral edges 615 adjacent to theconcave groove 610 contact the shoulder portion 530 of the pads 510(both shown in FIG. 5C). Contact between the peripheral edges 615 andthe shoulder portion 530 (shown in FIG. 5C) provides the gap 520. Abeveled edge 620 connects one of the peripheral edges 615 (e.g., anouter peripheral edge) with an outer wall 625. The beveled edge 620 maycontact the angled surface 540 of the pads 510 (both shown in FIG. 5C).

FIGS. 7A-7D are various views showing details of the substrateinput/output chamber 122. FIG. 7A is an isometric bottom view of thesubstrate input/output chamber 122 showing a substrate lift mechanism700 that moves the lift pins 410. The substrate lift mechanism 700includes a support plate 702 that supports a motor 704 that is coupledto the cooling platen 280 and a plurality of lift pin assemblies 706.Also shown is a vacuum system 708 having a plurality of primary vacuumtubes 710. The primary vacuum tubes 710 couple to the cooling platen 280and are utilized to evacuate passages associated with the lift pins 410disposed therein. The vacuum system 708 and the primary vacuum tubes 710are in fluid communication with each other and will be described in moredetail in FIG. 9A.

FIGS. 7B and 7C are side cross-sectional views of a portion of thecooling platen 280 showing a movement provided by the substrate liftmechanism 700. FIG. 7B shows the lift pin 410 in an extended positionand FIG. 7C shows the lift pin 410 in a retracted position. As shown inFIG. 7B, a distance 746 is between the upper surface of the tip 412 andthe substrate receiving surface 515. FIG. 7D is an enlarged sectionalview of the substrate lift mechanism 700 of FIG. 7B. While only one liftpin 410 and associated substrate lift mechanism 700 is shown in FIGS.7B-7D, it is noted that each lift pin 410 of the plurality of lift pins410 on the support plate 702 will have an associated substrate liftmechanism 700.

As shown in FIGS. 7B-7D, the lift pin assembly 706 includes a bellows708 disposed between the cooling platen 280 and a base housing 711 thatis coupled to the support plate 702. The bellows 708 may be fabricatedfrom a metallic alloy having a low coefficient of thermal expansion aswell as high strength. In one example, the bellows 708 may be a Ni—Mo—Cralloy, such as an alloy material sold under the trade name HAYNES® 242®.A seal 709, such as an O-ring, may be provided at the interface betweenthe base housing 711 and the support plate 702. A mounting plate 713 maybe coupled between the cooling platen 280 and the bellows 708. Themounting plate 713 may be coupled to the cooling platen 280 viafasteners.

A portion of the shaft 413 of the lift pin 410 is disposed in the basehousing 711. For example, as best shown in FIGS. 7B and 7D, an end ofthe shaft 413 opposite to the tip 412 is coupled to a gripping member712. The gripping member 712 may be fabricated from a plastic materialusable in high heat environments, such as a polyimide-based polymer soldunder the trade name VESPEL®. The gripping member 712 is coupled to aretainer housing 714. The retainer housing 714 receives a lip 716 of thegripping member 712 on one end thereof. The opposing end of the retainerhousing 714 is coupled to a base pin 718. The base pin 718 may becoupled to the support plate 702. Materials for the base pin 718, thebase housing 711, and the retainer housing 714 include metals, such asstainless steel.

Referring again to FIGS. 7B and 7C, the bushings 417 disposed about oneof the lift pins 410 are shown. Each of the bushings 417 may befabricated from a plastic material usable in high heat environments.Each of the bushings 417 may be secured by an internal retainer 724,such as a snap ring retainer. A limit member 726, which may be a bolt orthreaded shaft, is shown coupled to the support plate 702. A height ofthe limit member 726 may be adjusted, such as in the Z direction, tolimit the movement of the lift pin 410 in the Z direction, as shown inFIG. 7B.

FIG. 8 is an enlarged sectional view of the motor 704 coupled to thesupport plate 702 via a flexible joint member 800. The flexible jointmember 800 includes a base 805 that is coupled to the support plate 702by a plurality of base fasteners 810. Each of the base fasteners 810passes through oversize holes 815 formed in the support plate 702. Eachof the oversize holes 815 has a diameter greater than a diameter of thebase fasteners 810, which allows passage of the base fasteners 810through the holes 815 to fasten to the base 805. The base 805 includes athrough-slot 820 that receives a portion of a central fastener 825. Thecentral fastener 825 couples the motor 704 to the base 805. Thethrough-slot 820 exposes at least a portion of a head 830 of the centralfastener 825, which enables rotation of the central fastener 825 to movethe central fastener 825 along the Z direction. When actuated, theflexible joint member 800 provides a gap 835 of a few millimetersbetween the support plate 702 and a peripheral region of the base 805.

FIGS. 9A and 9B are isometric views of the substrate input/outputchamber 122 showing details of the vacuum system 708. FIG. 9A is anisometric bottom view of the substrate input/output chamber 122 and FIG.9B is an isometric sectional view of a bottom of the substrateinput/output chamber 122.

In FIGS. 9A and 9B, the support plate 702 is disposed below the coolingplaten 280, and the motor 704 as well as the plurality of lift pinassemblies 706 are coupled therebetween. A plurality of primary vacuumtubes 710 are shown in FIG. 9A. Each primary vacuum tube 710 isassociated with a respective lift pin assembly 706 and is coupled to afore line 900 by one or more secondary vacuum tubes 905. An isolationvalve 910 is shown positioned between the primary vacuum tubes 710 andthe fore line 900.

As shown in FIG. 9B, each of the primary vacuum tubes 710 (only one isshown in FIG. 9B) is fluidly coupled to a lift pin passage 915 by a bore920, both of which are formed in the cooling platen 280. For example,the lift pin passage 915 is a through-hole formed between major surfacesof the cooling platen 280, and the bore 920 may be a passage formedalong a length of the lift pin passage 915 to one major surface of thecooling platen 280, which interfaces with the primary vacuum tube 710.In operation, the vacuum system 708 is coupled to the fore line 900which is coupled to the vacuum pump 236 (shown in FIG. 2 ). The vacuumpump 236, while utilized to evacuate the lift pin passage 915, is alsoutilized to evacuate the chamber volume 218 of the substrateinput/output chamber 122.

FIG. 10 is a schematic sectional view of a process chamber 1000according to one embodiment. The process chamber 1000 may be one or moreof the processing chambers 110, 112, 132, 128, 120 shown in FIG. 1 .

A susceptor 1006 is located within the process chamber 1000 between anupper dome 1028 and a lower dome 1014. The process chamber 1000 may beused to process one or more substrates, including the deposition of amaterial on an upper surface of a substrate 124. The process chamber1000 may include an array of radiant heating lamps 1002 for heating,among other components, a back side 1004 of the susceptor 1006 disposedwithin the process chamber 1000. A “susceptor” as used herein is definedas an object that absorbs radiant energy and converts the absorbedradiant energy into heat energy that heats another object placed thereonor nearby. Although the process chamber 1000 includes the susceptor1006, embodiments of the carrier 206 described herein may be used withother types of substrate supports or pedestals, and may be constructedsimilarly to the susceptor 1006. The upper dome 1028, the lower dome1014 and a base ring 1036 that is disposed between the upper dome 1028and lower dome 1014 generally define an internal region of the processchamber 1000. The substrate 124, with a device side 1016 facing up andpositioned on a front side 1010 of the susceptor 1006 on a carrier 206as described herein, can be brought into the process chamber 1000 andpositioned onto the susceptor 1006 through a loading port 1003. Thesusceptor 1006 may be supported by a susceptor support structure 1090.The susceptor support structure 1090 includes at least three firstsupport arms 1092 (only two are shown) supported by a central shaft1032. In one embodiment, lowering the susceptor 1006 on the centralshaft 1032 allows carrier lift pins 1005 to contact the carrier 206. Thecarrier lift pins 1005, passing through holes in the first support arms1092 and holes in the susceptor 1006, raise the carrier 206 and thesubstrate 124 from the susceptor 1006. The carrier 206 may be disposedin a recess or groove 1025 formed in the front side 1010 of thesusceptor 1006. The susceptor 1006, while located in the processingposition as shown, divides the internal volume of the process chamber1000 into a process gas region 1056 that is above the substrate 124, anda purge gas region 1058 below the susceptor 1006. The susceptor 1006 maybe rotated as well as move the substrate 124 and the carrier 206 in anup and down direction 1034. The lamps 1002 may be configured to includebulbs 1041 and are used to heat the substrate 124. An optical pyrometer1018 may be used for temperature measurements/control on the substrate124. The lamps 1002 may be contained within a lamphead 1045. Thelamphead 1045 may be cooled during or after processing by, for example,a cooling fluid introduced into channels 1049 located between the lamps1002. Process gas supplied from a process gas supply source 1072 isintroduced into the process gas region 1056 through a process gas inlet1074 formed in the base ring 1036. The process gas exits the process gasregion 1056 (along flow path 1075) through a gas outlet 1078 located onthe side of the process chamber 1000 opposite the process gas inlet1074. Removal of the process gas through the gas outlet 1078 may befacilitated by a vacuum pump 1080 coupled thereto. A circular shield1067 or a preheat ring may be optionally disposed around the susceptor1006. The susceptor 1006 may also be surrounded by a liner assembly1063. The shield 1067 prevents or minimizes leakage of heat/light noisefrom the lamps 1002 to the device side 1016 of the substrate 124 whileproviding a pre-heat zone for the process gases. The liner assembly 1063shields the processing volume (i.e., the process gas region 1056 andpurge gas region 1058) from metallic walls of the process chamber 1000.The metallic walls may react with precursors and cause contamination inthe processing volume. The shield 1067 and/or the liner assembly 1063may be made from CVD SiC, sintered graphite coated with SiC, grown SiC,opaque quartz, coated quartz, or any similar, suitable material that isresistant to chemical breakdown by process and purging gases. Areflector 1022, secured to the upper dome 1028 using a clamp ring 1030,may be optionally placed outside the upper dome 1028. The reflector 1022can have one or more channels 1026 for connection to a cooling source(not shown). The channel 1026 connects to a passage (not shown) formedon a side of the reflector 1022.

FIG. 11 is an isometric view of the susceptor 1006 of FIG. 10 . Thecarrier 206 is supported by the carrier lift pins 1005 to space thesubstrate 124 (a portion of which is shown supported by the carrier 206)away from the front side 1010 of the susceptor 1006. The position of thecarrier 206 and the substrate 124 shown in FIG. 11 may be a transferposition where a robot (not shown) may enter the space between the frontside 1010 of the susceptor 1006 and the substrate 124.

The substrate support 190 includes the central shaft 1032 and an outershaft 1100 disposed about the central shaft 1032. One or both of thecentral shaft 1032 and the outer shaft 1100 are linearly movablerelative to the other. In one embodiment, the central shaft 1032 ismovable in the Z direction while the outer shaft 1100 is stationary inorder to raise or lower the susceptor 1006 relative to the carrier liftpins 1005. The carrier lift pins 1005 are disposed on second supportarms 1105 that are generally parallel to the first support arms 1092.Ends of the second support arms 1105 include pads 1110 where the carrierlift pins 1005 are supported during transfer of the carrier 206. Thefirst support arms 1092 include angled extensions 1115 that contact theback side 1004 of the susceptor 1006 at a perimeter 1120 thereof. Thecarrier lift pins 1005 are movably disposed through openings 1125 formedin the first support arms 1092 to allow the carrier lift pins 1005 tomove in the Z direction relative to the first support arms 1092.

FIG. 12 is an enlarged sectional view of a portion of the susceptor 1006and the carrier 206 of FIG. 10 . As described in FIG. 10 , the carrier206 is disposed in a groove 1025 formed in the front side 1010 of thesusceptor 1006. One of the carrier lift pins 1005 is provided through anopening 1200 formed in the susceptor 1006 adjacent to the groove 1025.In the processing position as shown in FIGS. 10 and 12 , the carrierlift pin 1005 disengages the carrier 206 such that the carrier 206 restsor is received in the groove 1025. For example, the groove 1025 includesa reference surface 1205 where the peripheral edges 615 of the carrier206 may be supported. In the processing position as shown, the groove1025 and the carrier 206 are constructed such that an upper surface 1210of the carrier 206 is below a plane of one or both of the front side1010 of the susceptor 1006 and a plane of an upper surface of thesubstrate 124. The carrier lift pin 1005 includes a flared head 1215that allows the carrier lift pin 1005 to be suspended within thesusceptor 1006 as well as being spaced away from the carrier 206. Forexample, the carrier lift pin 1005 includes a circular angled sidewall1220 that fits with an angled side 1225 of the opening 1200.

However, during transfer, the carrier 206 having the substrate 124thereon may be lifted away from the susceptor 1006. For example, thesusceptor 1006 may be urged downward (in the Z direction) such that aconvex portion 1230 of the flared head 1215 contacts the concave groove610 of the carrier 206. Continued lifting of the lift pin 1005 in the Zdirection spaces the substrate 124 away from the front side 1010 of thesusceptor 1006 as shown in FIG. 11 . Spacing the substrate 124 and thecarrier 206 away from the susceptor 1006 allows a robot blade (notshown, for example the blade 134 of the vacuum robot 130 shown in FIG. 1) to enter therebetween.

While the foregoing is directed to embodiments of the presentdisclosure, other and further embodiments of the disclosure may bedevised without departing from the basic scope thereof, and the scopethereof is determined by the claims that follow.

The invention claimed is:
 1. A chamber, comprising: a platen having aheat transfer element embedded therein; a plurality of carrier holderspositioned about the platen; a plurality of support members extendingfrom the plurality of carrier holders; a carrier positioned on thesupport members of one of the plurality of carrier holders; and a liftpin assembly, comprising: a support plate, a base housing coupled to thesupport plate, a shaft made of a first material and comprising adepression formed in the shaft, the shaft at least partially disposed inthe base housing, a tip made of a second material and comprising aprotruded portion fitted into the depression using an interference fit,wherein the second material is softer than the first material, agripping member disposed in the base housing, wherein an end of theshaft is coupled to the gripping member, and a retainer housing disposedin the base housing and coupled to the support plate, wherein a lip ofthe gripping member is received in the retainer housing.
 2. The chamberof claim 1, wherein each of the plurality of carrier holders includes aplurality of support members extending therefrom to support the carrier.3. The chamber of claim 1, wherein the lift pin assembly comprises aplurality of lift pins movably disposed through the platen.
 4. Thechamber of claim 3, wherein each of the plurality of lift pins comprisesthe tip and the shaft.
 5. The chamber of claim 4, wherein the secondmaterial of the tip is a polymer material and the first material of theshaft is a metallic material.
 6. The chamber of claim 3, wherein each ofthe plurality of lift pins is operably coupled to a dedicated actuator.7. The chamber of claim 3, wherein the plurality of lift pins aredisposed in openings formed in the platen, and each of the openings isfluidly coupled to a vacuum system.
 8. The chamber of claim 3, whereinthe plurality of lift pins are disposed inwardly of the carrier and theplurality of carrier holders.
 9. The chamber of claim 1, wherein each ofthe plurality of carrier holders comprises a standoff and a curved lip.10. The chamber of claim 1, wherein each of the plurality of carrierholders is mounted to a support that is coupled to a shaft extendingthrough a bottom of the chamber.
 11. A lift pin assembly, comprising: asupport plate; a base housing coupled to the support plate; a shaft madeof a first material and comprising a depression formed in the shaft, theshaft at least partially disposed in the base housing; a tip made of asecond material and comprising a protruded portion fitted into thedepression using an interference fit, wherein the second material issofter than the first material; a gripping member disposed in the basehousing, wherein an end of the shaft is coupled to the gripping member;and a retainer housing disposed in the base housing and coupled to thesupport plate, wherein a lip of the gripping member is received in theretainer housing.
 12. The lift pin assembly of claim 11, wherein thefirst material is a metallic material and the second material is apolymer material.
 13. The lift pin assembly of claim 11, furthercomprising a bellows disposed about at least part of the shaft.
 14. Amethod of transferring a substrate to a chamber, comprising: positioningthe substrate above a carrier positioned on one of a plurality ofcarrier holders positioned about a platen; positioning the substrate ona plurality of lift pins of a lift pin assembly, the lift pin assemblycomprising: a support plate, a base housing coupled to the supportplate, a shaft made of a first material and comprising a depressionformed in the shaft, the shaft at least partially disposed in the basehousing, a tip made of a second material and comprising a protrudedportion fitted into the depression using an interference fit, whereinthe second material is softer than the first material, a gripping memberdisposed in the base housing, wherein an end of the shaft is coupled tothe gripping member, and a retainer housing disposed in the base housingand coupled to the support plate, wherein a lip of the gripping memberis received in the retainer housing; and positioning the substrate onthe carrier.
 15. The method of claim 14, wherein the positioning of thesubstrate above the carrier comprises extending a first robot blade intothe chamber.
 16. The method of claim 15, wherein the positioning of thesubstrate on the plurality of lift pins comprises lowering the firstrobot blade to contact the substrate with the plurality of lift pins,wherein each of the plurality of lift pins comprises the tip and theshaft.
 17. The method of claim 16, wherein the positioning of thesubstrate on the carrier comprises: raising the plurality of carrierholders to contact the substrate with the carrier.
 18. The method ofclaim 17, further comprising: retracting the plurality of lift pins awayfrom the substrate; extending a second robot blade into the chamber; andlowering the plurality of carrier holders to contact the carrier withthe second robot blade and position the carrier and the substrate on thesecond robot blade.
 19. The chamber of claim 1, further comprising: aseal disposed at an interface between the base housing and the supportplate; a base pin coupled to the retainer housing and the support plate;a bushing disposed about the shaft; a motor coupled to the support platevia a flexible joint member, the motor coupled between the support plateand the platen.
 20. The chamber of claim 19, wherein the lift pinassembly further comprises: a bellows disposed between the platen andthe base housing, the bellows made of a metallic alloy; and a mountingplate coupled between the platen and the bellows, the mounting platecoupled to the platen via fasteners.
 21. The chamber of claim 19,wherein: the base pin and the base housing are made of one or moremetals; the bushing is made of a plastic material and is secured by aninternal retainer; a limit member is coupled to the support plate; andthe flexible joint member comprises: a base coupled to the support plateby a plurality of base fasteners, each of the base fasteners passingthrough oversize holes formed in the support plate, each of the oversizeholes having a diameter greater than a diameter of the base fasteners,the base comprising a through-slot that receives a portion of a centralfastener, and the central fastener coupling the motor to the base. 22.The chamber of claim 21, wherein the through-slot exposes at least aportion of a head of the central fastener, rotation of the centralfastener moves the central fastener, and the flexible joint memberprovides a gap between the support plate and a peripheral region of thebase when the flexible joint member is actuated.
 23. The lift pinassembly of claim 12, wherein: the polymer material comprises one ormore fluoropolymers; the gripping member comprises a polyimide-basedpolymer; and the retainer housing comprises a metal.
 24. The chamber ofclaim 7, wherein the vacuum system comprises: a plurality of primaryvacuum tubes associated with the openings and coupled to a fore line byone or more secondary vacuum tubes, each of the primary vacuum tubesfluidly coupled to one of the openings by a bore formed in the platen,wherein the openings are formed between two major surfaces of theplaten, and the bore is formed between the respective one of theopenings and one of the two major surfaces.